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EAP設備自動化(Equipment Automation Programming)
EAP(Equipment Automation Programming)實現了對生產線上機臺的實時監控,是工廠自動化不可缺少的控制系統。EAP系統與FAB中的機臺緊密相關,系統的設計與開發必須與生產線的機臺實際生產流程相一致,才能達到控制機臺生產的目的。
EAP是MES與設備的橋梁,EAP通過SECS國際標準協議與機臺進行數據傳輸。SECS是半導體設備(半導體行業稱設備為機臺)必須遵循的一種國際通信協議。EAP就是通過SECS與設備通信、傳輸數據、發送指令控制設備按照預先定義的流程進行生產加工,達到對設備遠程控制和狀態監控,實現設備運行的自動化。
EAP是CIMS系統最低層的子系統,也是FAB中最為關鍵的系統之一。所有的生產過程,生產數據和機臺狀態數據都是通過EAP系統收集,然后傳送給MES、AS等服務器對應的數據庫,MES通過這些數據對產品和設備事件進行跟蹤和監控。如果沒有EAP系統FAB中的CIMS就沒有實際的意義,生產的自動化也就無從談起。EAP系統的開發基于SECS國際標準協議。
EAP在CIMS中的地位
EAP是CIMS系統與設備系統聯系最緊密的子系統,也是CIMS中底層的系統。FAB生產線實現自動化過程中,EAP是不可缺少的子系統。

EAP系統功能
設備初始化控制。當設備需要重啟并建立了通訊連接后,需要進行一些初始化工作,如定義事件、警報等。
物料狀態跟蹤。實時對正在設備上加工的物料狀態進行跟蹤監控,如晶圓目前正在哪個加工倉(Chamber),進行哪一個步驟的加工等。
警報管理。當機臺出現故障時,根據機臺的警報及時傳達給相應的設備工程師,以便及時處理。
機臺狀態監控。實時監控機臺的狀態,是運行、空閑還是維護等,以便合理地利用機臺,提高設備利用率。

配方管理。機臺在跑不同批次的貨時,采用不同的配方,設備自動化系統通過對每一批貨的判斷,指示機臺采用相應的配方進行加工。
數據采集。在半導體生產過程中,將會產生大量諸如溫度、壓力等參數,這些參數對于晶圓能夠保持在正常合理的參數下進行加工,有著非常重要的參考價值。在生產運行過程中,當工藝設備生產到一定的批數以后,有些參數會漂移,通過缺陷檢測分類系統能夠及時探測到偏差,并通過 Run-to-Run 的實時方式做調整,不斷搜集機臺當前運行的參數,當參數偏離原值、并可能超出設定的區間范圍時,可以通過實時調整的方式直接修改參數,并不斷的反饋、調整以確保生產的正常運營。
機臺生產模式控制??刂茩C臺的生產模式,是自動生產還是手動操作。因為有些情況,機臺需要手動操作,比如在上線測試的時候。

EAP 
EAP (equipment automation programming) realizes the real-time monitoring of machines on the production line. It is an indispensable control system for factory automation. EAP system is closely related to the machine in fab. The design and development of the system must be consistent with the actual production process of the machine in the production line in order to achieve the purpose of controlling the machine production.
EAP is the bridge between MES and equipment. EAP transmits data with the machine through secs international standard protocol. Secs is an international communication protocol that must be followed by semiconductor equipment (equipment is called machine in semiconductor industry). EAP is to communicate with the equipment, transmit data and send instructions through secs to control the equipment to carry out production and processing according to the pre-defined process, so as to achieve remote control and status monitoring of the equipment and realize the automation of equipment operation.
EAP is the lowest subsystem of CIMS system and one of the most critical systems in fab. All production process, production data and machine status data are collected through EAP system and then transmitted to the database corresponding to MES, as and other servers. MES tracks and monitors product and equipment events through these data. If there is no EAP system, CIMS in fab has no practical significance, and production automation is impossible. The development of EAP system is based on secs international standard protocol.
The position of EAP in CIMS
EAP is the most closely related subsystem between CIMS system and equipment system, and it is also the bottom system in CIMS. EAP is an indispensable subsystem in the automation process of Fab production line.
EAP system functions
Device initialization control. When the device needs to be restarted and a communication connection is established, some initialization work needs to be carried out, such as defining events, alarms, etc.
Material status tracking. Track and monitor the status of materials being processed on the equipment in real time, such as which chamber the wafer is currently in and which step is being processed.
Alert management. When the machine fails, it shall be timely transmitted to the corresponding equipment engineer according to the alarm of the machine for timely treatment.
Machine condition monitoring. Monitor the status of the machine in real time, whether it is running, idle or maintenance, so as to make rational use of the machine and improve the utilization rate of the equipment.
Recipe management. When running different batches of goods, the machine adopts different formulas. The equipment automation system instructs the machine to adopt the corresponding formula for processing through the judgment of each batch of goods.
Data collection. In the process of semiconductor production, a large number of parameters such as temperature and pressure will be produced. These parameters have very important reference value for the wafer to be processed under normal and reasonable parameters. In the process of production and operation, some parameters will drift when the process equipment is produced to a certain number of batches. The deviation can be detected in time through the defect detection and classification system, and adjusted through the run-to-run real-time mode to continuously collect the current operating parameters of the machine. When the parameters deviate from the original value and may exceed the set range, The parameters can be directly modified through real-time adjustment, and continuous feedback and adjustment can be made to ensure the normal operation of production.
Machine production mode control. Control the production mode of the machine, whether it is automatic production or manual operation. Because in some cases, the machine needs to be operated manually, such as during on-line test.

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