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高溫無塵無氧烤箱HCM-100系列

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晶圓級PI膠工藝烘箱

Product Description: wafer level PI glue process oven

內部凈化等級可達Class100

The internal purification level can reach class100

內腔無氧設計,滿足20PPM以下的氧濃度需求

The oxygen free design of the inner cavity can meet the oxygen concentration requirements below 20ppm

支持SECS/GEM自動聯機需求

Support SECS/GEM automatic online requirements

 

 

  

 

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無塵等級:Class 100;

Parameters: dust free grade: Class 100;

含氧量:<=20ppm (動態監控);

Oxygen content: < = 20ppm (dynamic monitoring);

溫度范圍: +60~ +500°C;

 Temperature range: + 60 ~ + 500 ° C;

溫度均勻度:±1.5% (空載) ;

Temperature uniformity: ± 1.5% (no load);

升溫速度:常溫~+400°C,升溫速率 > 6°C/min;

Heating rate: room temperature ~ + 400 ° C, heating rate > 6 ° C / min;

降溫速度:夾層降溫裝置,平均速率 5℃/min以內;

Cooling rate: sandwich cooling device, the average rate is less than 5 ℃ / min;

降溫斜率可設定,1.5h可從375℃ 降溫到80℃;

The cooling slope can be set, and the temperature can be reduced from 375 ℃ to 80 ℃ in 1.5 h;

溫度過沖:<2℃@200℃,<3℃@300℃;

Temperature overshoot: < 2 ℃ @ 200 ℃, < 3 ℃ @ 300 ℃;

溫控精度:±1°C (空載);

Temperature control accuracy: ± 1 ° C (no load);

工作腔尺寸: W966 mm×H715 mm×D588 mm;

Working chamber size: w966 mm × H715 mm × D588 mm;  

Single chamber;

外形尺寸:W1910 mm×H1930 mm×D1037 mm;

Overall dimension: w1910 mm × H1930 mm × D1037 mm;

烘箱擱板為活動式,共兩片, 擱板承重≥30kg;

The drying oven shelf is movable, with two pieces in total, and the shelf load is more than or equal to 30kg;

加熱功率:18KW;

Heating power: 18kw;

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地址:上海市浦東新區張楊路2389弄3號樓普洛斯大廈768室      電話:+86 13761002245      郵箱: xiwang@amsemi.com

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